QVOL‑2 — Quantum Sensors for Scalable Applications

The QVOL‑2 project aims to advance quantum sensing toward market deploy­ment. Build­ing on the first QVOL phase, the focus is on enabling technolo­gies for solid-state defect sensors in silicon carbide, with an empha­sis on scala­bil­ity and energy efficiency. In addition, new defect types such as divacan­cies are being inves­ti­gated to increase sensor sensitivity.

The project focuses on solid-state defect sensors that operate at room temper­a­ture and offer high integra­tion capabil­ity and scala­bil­ity. Key techno­log­i­cal prior­i­ties include mater­ial charac­ter­i­za­tion, defect gener­a­tion, optimiza­tion of excita­tion and readout, inves­ti­ga­tion of photonic wire bonds, and overall system integra­tion. The goal is the indus­trial high-volume produc­tion of quantum sensors. 
Integrated chip platforms for the control and utiliza­tion of color centers in silicon carbide for quantum sensing.

Scalable SiC-based quantum sensors are well suited for high-volume markets such as the automo­tive indus­try as well as IoT and IoE appli­ca­tions. Their compat­i­bil­ity with standard semicon­duc­tor manufac­tur­ing processes enables cost-effective large-scale implementation.

TEAM

Univer­sity of Stuttgart

Prof. Dr. Jens Anders

Direc­tor of the Insti­tute of Smart Sensors
Spokesman for QSens

Univer­sity of Stuttgart

Prof. Dr. Jörg Wrachtrup

Head of Department
(3rd Physic Institute)

Infineon Technolo­gies

Dr. Heinrich Heiss

Direc­tor Techni­cal Marketing

Vanguard Automa­tion GmbH

Philipp-Immanuel Dietrich

Technol­ogy Fellow

IMS CHIPS

Dr. Mathias Kaschel

Business Unit Manager – Silicon Photonics